Für Rundstifte Ø0,40-0,56mm
oder Vierkantstifte 0,25x0,45mm.
For Ø0.40-0.56mm round pins
or 0.25x0.45mm rectangular pins.
326 / 327
IC Sockets / IC Headers 1.78mm Pitch - Shrink DIP
| Case/Cover/Actuator | Thermoplastic, rated UL94 V-0 |
|---|---|
| Contact Material | Sleeve: screw machined brass Clip: 4-Finger-Clip, Beryllium-Copper |
| Contact Surface | Acc. to options (see below), over Ni (2 ... 3µm) |
| Solderability | IEC 60512-12A |
| Contact Resistance | < 10mΩ |
| Insulation Resistance | > 1000MΩ |
| Test Voltage | 1kVRMS |
| Voltage Rating | 100VRMS / 150VDC |
| Current Rating | 1A |
| Temperature Range | -55°C ... +125°C |
| Processing | Wave or reflow soldering |
| Series | Contacts* | DIP-Spacing* | Sleeve Plating | Clip Plating* |
|---|---|---|---|---|
| 326 | 16 | 3 | 50 | 00 |
|
326 IC-Socket |
16 ===========> 28/30/32/48 ====> 20/24/28/40/42/48/ 64 ===========> |
3 7,62mm 4 10,16mm
6 15,24mm 7 19,05mm |
50 Tin plated (Standard) |
00 Gold plated (Standard) 10 0,25µm gold plated 30 0,75µm gold plated |
| Series | Contacts* | Rows | Sleeve Plating | Clip Plating* |
|---|---|---|---|---|
| 327 | 21 | 1 | 50 | 00 |
|
327 IC Header |
21/38 Single row |
1 Single row |
50 Tin plated (Standard) |
00 Gold plated 10 0,25µm gold plated |
Technical Information:
* Bestellbeispiel: Bitte durch Ihre Spezifikationen ersetzen.
Order Example: Please replace by your specifications.